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METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD
METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD
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机译：电容器嵌入式印刷电路板和电容器嵌入式印刷电路板的基板制造方法
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摘要
A method of manufacturing a capacitor-embedded printed circuit board, the method including providing a substrate on which a first metal layer, a dielectric layer and an adhesive resin layer are stacked on the order thereof; etching a part of the first metal layer to form a first electrode and a first circuit pattern; compressing a surface of the substrate, on which the first electrode is formed, onto a core board by interposing an insulation resin layer; forming a second electrode and a second circuit pattern on the adhesive resin layer; stacking an insulation board on the substrate such that the second electrode and the second circuit pattern are covered; and forming a third circuit pattern on the insulation board.
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