Bonding quality inspection apparatus and bonding quality inspection method
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机译：粘接质量检查装置及粘接质量检查方法
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摘要
An object of the present invention is to provide a bonding quality inspection apparatus and a bonding quality inspection method capable of accurately performing a bonding quality inspection in real time on the total number of products in which a bonding member is bonded to a member to be bonded. Therefore, the quality required for the joint after the durability test is evaluated from the ammeter, frequency meter, encoder, and recording unit for detecting the joining waveform generated in the joining process in the joining device and the detected joining waveform. A feature point extraction unit that extracts a feature point that correlates with a post-endurance physical quantity, an arithmetic expression setting unit that stores an arithmetic expression for calculating the post-endurance physical quantity, and an arithmetic expression that is extracted Based on the characteristic points, the calculation unit for calculating the post-endurance physical quantity of the joint and the comparison between the calculated post-endurance physical quantity and a preset threshold value results in good joint quality at the joint. It provided a determining section.
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