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The PVD copper seed overhang re-spatter which accompanies the ionization of the copper which is strengthened
The PVD copper seed overhang re-spatter which accompanies the ionization of the copper which is strengthened
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机译:PVD铜种子突出物会重新飞溅,伴随铜离子的离子化增强
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摘要
Method and the device which make the metal accumulate on the baseplate where pattern was formed are offered. Metal layer, is formed with the physical evaporation process which possesses 1st energy. 2nd physical evaporation process is done with respect to metal layer making use of 2nd energy, here, sedimentary layer receives the interaction of brittleness and plastic surface correction process, isomorphic metal layer is almost formed on the baseplate.
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