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To its products thermal decomposition mutual fusion method after patterning to various substrate with low dielectric loss factor of the thermal decomposition of particles and thermal decomposition mutual fusion method by selective heating of the thermal decomposition of particles using a high-frequency electromagnetic radiation application
To its products thermal decomposition mutual fusion method after patterning to various substrate with low dielectric loss factor of the thermal decomposition of particles and thermal decomposition mutual fusion method by selective heating of the thermal decomposition of particles using a high-frequency electromagnetic radiation application
PROBLEM TO BE SOLVED: To provide a new technical method as a direct circuit drawing method using particles capable of absorbing high-frequency electromagnetic waves, and makes it possible to form a low-resistance mounted component in a short period of time even on a board material having a low heat resistance.;SOLUTION: The method is a thermolysis mutual fusion method for heat decomposable particles for heating the heat decomposable particles selectively, by performing on various kinds of boards surface application or circuit patterning of particles having a heat decomposable property and capable of absorbing high frequency electromagnetic waves, and subsequently performing high frequency electromagnetic irradiation, and relates to electronic mounted components such as conductive materials, conducting paths, bumps, pads, vias, etc. formed by the method.;COPYRIGHT: (C)2006,JPO&NCIPI
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