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QUALITY CONTROL METHOD OF GRINDING WHEEL IN GRINDING WORK

机译:磨削工作中砂轮的质量控制方法

摘要

PROBLEM TO BE SOLVED: To provide a quality control method of a grinding wheel in grinding work, capable of detecting a grinding mark caused by a fixed abrasive grain of a large grain size.;SOLUTION: While determining the reference surface area of silicon powder in silicon sludge generated when grinding a grinding object by a reference grinding wheel, the measured surface area of the silicon powder in the silicon sludge generated when grinding the same grinding object as the grinding object by using the grinding wheel, is determined. Afterwards, since quality of the grinding wheel is detected from a difference between the measured surface area and the reference surface area, the grinding mark caused by the fixed abrasive grain of a large diameter can be easily detected from a change in the surface area of the silicon powder of the silicon sludge.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种磨削作业中的砂轮质量控制方法,能够检测出由大粒径的固定磨粒引起的磨痕。解决方案:在确定硅粉的参考表面积时确定当通过基准砂轮研磨磨削物体时产生的硅泥,测定当使用砂轮研磨与磨削物体相同的磨削物体时在硅泥中测量的硅粉表面积。之后,由于从测量的表面积与基准表面积之差检测出砂轮的质量,因此,可以容易地根据其表面积的变化来检测出由大直径的固定磨粒引起的磨痕。硅泥中的硅粉;版权所有:(C)2012,日本特许经营&INPIT

著录项

  • 公开/公告号JP2011230232A

    专利类型

  • 公开/公告日2011-11-17

    原文格式PDF

  • 申请/专利权人 SUMCO CORP;

    申请/专利号JP20100102911

  • 发明设计人 MORITA ETSURO;HIRANO KATSUYA;

    申请日2010-04-28

  • 分类号B24B7/22;H01L21/304;

  • 国家 JP

  • 入库时间 2022-08-21 17:42:16

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