首页> 外国专利> Cu-Ni-Si BASED COPPER ALLOY SHEET EXCELLENT IN FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING WORKING, AND METHOD OF MANUFACTURING THE SAME

Cu-Ni-Si BASED COPPER ALLOY SHEET EXCELLENT IN FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING WORKING, AND METHOD OF MANUFACTURING THE SAME

机译:加工后耐疲劳性和弹簧性能优异的Cu-Ni-Si基铜合金板及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si based copper alloy sheet which has excellent fatigue resistance and a spring property even if used at high temperature and high oscillation environment for a long time after bending working of a prescribed shape as a raw material as a relay movable piece, a socket terminal or the like of various electric parts.;SOLUTION: The Cu-Ni-Si based copper alloy sheet includes 1.0-3.0 mass% of Ni; 1/6-1/4 concentration of Si based on Ni, and a rest consisting of Cu and inevitable impurities, wherein orientations of all pixel in a measured area of a surface are measured at 0.5 μm of a step size by an EBSD method, an area ratio of a crystal grain in which an average orientation difference among the all pixel in the crystal grain is less than 4° when a border in which an orientation difference between abutting pixel is at least 5° is made a crystal grain boundary is 45-55% of a measured area, an area average GAM of a crystal grain existing in an area to be measured is 0.8-1.6°, a number of a Ni-Si precipitated object particle in which a particle diameter exceeds 100 nm is 0.2-0.7 piece/μm2, and a concentration of Si solid solved in a crystal grain is 0.1-0.4 mass%.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种即使在高温和高振动环境下长时间加工成规定形状的原材料后,也具有优异的抗疲劳性和弹性的Cu-Ni-Si基铜合金板。解决方案:该Cu-Ni-Si基铜合金薄板包含1.0-3.0质量%的Ni;用于制造可移动部件,各种电气部件的插座端子等的材料。基于Ni的Si的浓度为1 / 6-1 / 4,其余为Cu和不可避免的杂质,其中通过EBSD以0.5μm的步长在表面的测量区域中测量所有像素的取向。在该方法中,晶粒中所有像素之间的平均取向差小于4°的晶粒的面积比为2。当相邻像素之间的取向差至少为5°的边界时;使Ni-Si析出的目标粒子的数量为:晶界为测定面积的45-55%,存在于测定区域中的晶粒的面积平均GAM为0.8-1.6°。粒径超过100 nm的颗粒为0.2-0.7个/μm 2 ,并且固溶在晶粒中的Si固体的浓度为0.1-0.4质量%。;版权所有:(C)2012,日本特许厅

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