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Method for encapsulating chip on substrate of chip module, involves hardening filling material and dam material, and adjusting partial hardening of dam material during laying dam materials on radiation device of applicator
Method for encapsulating chip on substrate of chip module, involves hardening filling material and dam material, and adjusting partial hardening of dam material during laying dam materials on radiation device of applicator
The method involves creating chips (8, 9) of completely enclosing dam material by applying radiation-curable dam material (4) on a substrate surface by an applicator (2). The dam material is partially cured by irradiating using a radiation device (5). A region enclosed by the dam material is filled with radiation-curable filling material. The filling material and the dam material are hardened by irradiating using the radiation device. Partial hardening of the dam material is adjusted during laying of the dam materials on the radiation device of the applicator. The radiation device is designed as a UV light source such as UV LED, UV visible source of light. An independent claim is also included for device for encapsulating a chip on a substrate.
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