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METHOD FOR COATING THE FLUORESCENT SUBSTANCE OF A LIGHT EMITTING DIODE PACKAGE CAPABLE OF UNIFORMLY FORMING A FLUORESCENT SUBSTANCE COATING LAYER ON THE UPPER PART OF A CAVITY
METHOD FOR COATING THE FLUORESCENT SUBSTANCE OF A LIGHT EMITTING DIODE PACKAGE CAPABLE OF UNIFORMLY FORMING A FLUORESCENT SUBSTANCE COATING LAYER ON THE UPPER PART OF A CAVITY
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机译：用于在腔体上部均匀形成荧光物质涂层的发光二极管封装件的荧光物质涂层的方法
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摘要
PURPOSE: A method for coating the fluorescent substance of a light emitting diode package is provided to prevent a fluorescent substance from being inserted around a light emitting diode chip.;CONSTITUTION: A lead frame(10) forms a cup-shaped cavity(20). An encapsulating material(50), in which a fluorescent substance(60) is mixed, is prepared. A package, in which a light emitting diode chip(30) is mounted in the bottom of the cavity, is reversed upside down. The encapsulating material is inserted inside the cavity through the bottom surface of the package. The fluorescent substance is precipitated on the lighting emitting area surface of the package using the specific gravity difference of the encapsulating material and the fluorescent substance.;COPYRIGHT KIPO 2012
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