首页> 外国专利> TEST HEAD, ELECTRONIC COMPONENT TEST EQUIPMENT AND METHOD FOR LOADING PERFORMANCE BOARD ON THE ELECTRONIC COMPONENT TEST EQUIPMENT

TEST HEAD, ELECTRONIC COMPONENT TEST EQUIPMENT AND METHOD FOR LOADING PERFORMANCE BOARD ON THE ELECTRONIC COMPONENT TEST EQUIPMENT

机译:测试头,电子组件测试设备以及在电子组件测试设备上加载性能板的方法

摘要

An electronic device test apparatus comprising: a test apparatus body for testing IC devices formed on a wafer for electrical characteristics; a probe card for electrically connecting the IC devices and the test apparatus body; a prober for pushing the wafer against the probe card so as to electrically connect the IC devices and the probe card; an abutting mechanism extending toward the back surface of the probe card and abutting against the back surface of the probe card; and a lock mechanism fixing the extension of the abutting mechanism in the state with the abutting mechanism abutting against the back surface of the probe card.
机译:一种电子设备测试设备,包括:测试设备主体,用于测试形成在晶片上的IC设备的电特性;以及探针卡,用于将IC器件和测试装置主体电连接;探针将晶片推向探针卡,以将IC器件和探针卡电连接;抵接机构,其朝向探针卡的背面延伸并抵接于探针卡的背面。锁定机构在抵接机构与探针卡的背面抵接的状态下将抵接机构的延伸部固定。

著录项

  • 公开/公告号KR101015397B1

    专利类型

  • 公开/公告日2011-02-22

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20087014094

  • 申请日2006-03-10

  • 分类号H01L21/66;G01R31/26;G01R1/073;

  • 国家 KR

  • 入库时间 2022-08-21 17:50:37

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