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STRAINED SI BASED LAYER MADE BY UHV-CVD, AND DEVICES THEREIN
STRAINED SI BASED LAYER MADE BY UHV-CVD, AND DEVICES THEREIN
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机译:用特高压化学气相沉积法制得的应变SI基层及其装置
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摘要
A method for fabricating a strained Si based layer comprising the steps of: growing epitaxially a SiGe layer on a substrate, wherein creating a varying Ge concentration in the thickness direction of said SiGe layer, said Ge concentration having a first value at the interface with said substrate and having a second value at full thickness of said SiGe layer, said second value of Ge concentration being larger than said first value of Ge concentration, furthermore said SiGe layer imbedding a Ge overshoot zone, wherein larger than said second value; depositing epitaxially said Si baSed layer onto said SiGe layer; and transferring said strained Si based layer onto a second substrate.
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