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Forming inductor and transformer structures with magnetic materials using damascene processing for integrated circuits
Forming inductor and transformer structures with magnetic materials using damascene processing for integrated circuits
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机译：使用镶嵌工艺对集成电路用磁性材料形成电感器和变压器结构
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摘要
Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of magnetic material and at least one via structure disposed in a first dielectric layer, forming a second dielectric layer disposed on the first magnetic layer, forming at least one conductive structure disposed in the second dielectric layer, forming a third layer of dielectric material disposed on the conductive structure, forming a second layer of magnetic material disposed in the third layer of dielectric material and in the second layer of dielectric material, wherein the first and second layers of the magnetic material are coupled to one another.
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