Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

• 1. 盖器件或盖晶圆的制造方法、微机械封装的制造方法、封装器件的方法、盖晶圆、盖器件 [P] . 中国专利： CN113548635A . 2021-10-26
• 2. 一种微器件的封装方法及利用该方法封装的微器件 [P] . 中国专利： CN107785275A . 2018-03-09
• 3. Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package [P] . 美国专利： US7408434B2 . 2008-08-05

  机译： 嵌入衬底中的电感器，其制造方法，微器件封装以及用于微器件封装的盖的制造方法

• 4. INDUCTOR EMBEDDED IN SUBSTRATE, MANUFACTURING METHOD THEREOF, MICRO DEVICE PACKAGE, AND MANUFACTURING METHOD OF CAP FOR MICRO DEVICE PACKAGE [P] . 美国专利： US2008213966A1 . 2008-09-04

  机译： 基板中嵌入的感应器，其制造方法，微型设备封装以及微型设备封装的盖制造方法

• 5. Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package [P] . 美国专利： US2006290457A1 . 2006-12-28

  机译： 嵌入衬底中的电感器，其制造方法，微器件封装以及用于微器件封装的盖的制造方法

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• 3. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded MicroChannel Three-Dimensional-Manifold Coolers (EMMC)-Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices [J] . Sougata Hazra, Ki Wook Jung, Madhusudan lyengar, Journal of Electronic Packaging . 2020,第3期
• 4. Methodology for the additive manufacture of embedded conductive paths connecting microelectromechanical sensors using conductive and flexible filaments with extrusion devices [J] . Journal of international management . 2020,第2期
• 5. Methodology for the additive manufacture of embedded conductive paths connecting microelectromechanical sensors using conductive and flexible filaments with extrusion devices [J] . Cao Chuan, Cazon-Martin Aitor, Rodriguez-Ferradas Maria Isabel, Rapid prototyping journal . 2020,第2期
• 6. Analysis of the Reliability of Package-on-Package Devices Manufactured Using Various Underfill Methods [C] . E.O(n)iate, S.R.Idelsohn, M.A.Celigueta, Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008) . 2008
• 7. Fabrication of Elastomer Microfluidic Devices using Additive Manufacturing Methods. [D] . Lim, Christopher W. 2016
• 8. Rapid Laser Manufacturing of Microfluidic Devices from Glass Substrates [O] . Krystian L. Wlodarczyk, Richard M. Carter, Amir Jahanbakhsh, 2018
• 9. New method for medical devices design and manufacture: Case study-scapholunate implant [O] . Ferrer Mallorquí, Inès, Grabalosa Saubí, Jordi, Salvador, Antoni, 2016

• 1. 3D printed microfluidic devices:a review focused on four fundamental manufacturing approaches and implications on the field of healthcare [J] . Viraj Mehta ,Subha N.Rath . 生物设计与制造 . 2021,第002期
• 2. SINOPEC’s Package Technology for Manufacture of Propylene Oxide Using HPPO Method Has Been Licensed for The First Time [J] . . 中国炼油与石油化工:英文版 . 2021,第4期
• 3. New Method for Diagnostics of Ion Implantation Induced Charge Carrier Traps in Micro- and Nanoelectronic Devices [J] . Mukhtar Ahmed Rana . 核科学与技术国际期刊（英文） . 2012,第4期
• 4. 一种聚合物平板微器件的集成制造方法 [C] . Zheng Xu ,徐征 ,Ling-Gang Wang . 第十一届先进成型与材料加工技术国际研讨会 . 2014
• 5. 用于微纳制造的“钢笔式”微器件直写方法研究 [A] . 朱华敏 . 2018