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Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite

机译:多孔微针阵列的制造方法以及相应的多孔微针阵列和相应的基板复合材料

摘要

A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips.
机译:一种多孔微针阵列的制造方法,包括:形成多个多孔微针阵列,每个多孔微针阵列具有至少一个微针和位于半导体衬底的表面上的位于其下方的多孔载体区;在位于半导体衬底的背面上的半导体衬底的无孔残余层和载体区之间形成中间层,该中间层的孔隙率大于载体区;通过破坏中间层使残留层与载流子区分离;将微针阵列分离为相应的芯片。

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