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Analysis of an auxiliary leveler additive in an acid copper plating bath
Analysis of an auxiliary leveler additive in an acid copper plating bath
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机译:酸性镀铜液中助流平助剂的分析
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摘要
An auxiliary leveler additive that cannot be analyzed by conventional CVS methods for acid copper plating baths is analyzed by cyclic voltammetry at a platinum rotating disk electrode from its effect on the anodic current at very positive potentials.
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