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In-mold coating composition and in-mold coated molded body

机译：模内涂料组合物和模内涂料成型体

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摘要

[PROBLEMS TO BE SOLVED] There are provided an in-mold coating composition having an excellent adhesion to a thermosetting molding resin or a thermoplastic molding resin and an in-mold-coated molded product formed by coating effectively with a conductive coating film in a mold. [SOLUTION] This invention is an in-mold coating composition characterized by comprising components of (A) at least one selected from a urethane oligomer, an epoxy oligomer, a polyester oligomer and a polyether oligomer each having a (meth)acryloyl group, or an unsaturated polyester resin, (B) a monomer capable of copolymerizing with the (A) component, (C) a conductive particle formed by coating a surface of an inorganic particle with a conductive metal oxide particle, and (D) an organic peroxide polymerization initiator, wherein mass ratios of the (A) and (B) components satisfy (A)/(B) = 20/80-80/20, a mass ratio of the (C) component satisfies (C)/{(A)+(B)} = 5/100-50/100, and a mass ratio of the (D) component satisfies (D)/{(A)+(B)} = 0.1/100-5/100, and an in-mold-coated molded product using the composition.

机译：[解决的问题]提供对热固性成型树脂或热塑性成型树脂具有优异的密合性的模内涂料组合物和通过在模具中有效地涂布导电性涂膜而形成的模内涂布成型品。。 [解决方案]本发明是一种模内涂料组合物，其特征在于包含（A）的组分中的至少一种选自各自具有（甲基）丙烯酰基的氨基甲酸酯低聚物，环氧低聚物，聚酯低聚物和聚醚低聚物，或不饱和聚酯树脂;（B）能够与（A）组分共聚的单体;（C）通过用导电金属氧化物颗粒涂覆无机颗粒表面而形成的导电颗粒，以及（D）有机过氧化物聚合（A）成分和（B）成分的质量比满足（A）/（B）＝ 20 / 80-80 / 20的引发剂，（C）成分的质量比满足（C）/ {（A） +（B）} ＝ 5 / 100-50 / 100，（D）成分的质量比满足（D）/ {（A）+（B）} ＝ 0.1 / 100-5 / 100，且-使用该组合物的模具涂布的成型产品。

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公开/公告号JP4590473B2

专利类型
公开/公告日2010-12-01

原文格式PDF
申请/专利权人大日本塗料株式会社;
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申请/专利号JP20080314713
发明设计人大田賢治;城座慎一郎;米持建司;
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申请日2008-12-10
分类号C08F283/01;C09D4;C09D175/16;C09D163/10;C09D167/07;C09D171;C09D167/06;C09D7/12;C08F290/06;B29C45/16;C09D5/24;C08F2/44;B29L9;
国家 JP
入库时间 2022-08-21 18:17:19

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