首页> 外国专利> Atmospheric pressure transfer module for wafer with controlled small environment, method for making atmospheric pressure transfer module

Atmospheric pressure transfer module for wafer with controlled small environment, method for making atmospheric pressure transfer module

机译:用于环境受控的晶片的大气压传递模块,制造大气压传递模块的方法

摘要

An atmospheric transport module is provided. The module includes an enclosed housing having a top region, a central region, a bottom region, and a load cell region. A blower is located in the top region of the enclosed housing and is configured to generate a flow of air downward into the central region. A shelf in the load cell region defines a separation between the central region and the bottom region of the enclosed housing. The shelf is at least partially spaced apart from a wall of the load cell region to thereby define a slot behind the shelf. A perforated sheet is configured to extend horizontally from the shelf and further define the separation between the central region and the bottom region. In this example, air flow generated by the blower is restricted from freely flowing through the perforated sheet and is partially caused to be redirected toward the shelf of the load cell, through the slot and into the bottom region of the enclosure housing. A cassette having one or more wafers is configured to sit on the shelf in the load cell and thus be subjected to the redirected air flow. This redirected air flow will thus gently flow over the surfaces of the wafers and assist in removing post-process gases and particles from over the wafer surfaces while the wafers temporarily sit in the atmospheric transport module.
机译:提供了大气运输模块。该模块包括封闭的壳体,该封闭的壳体具有顶部区域,中心区域,底部区域和测力传感器区域。鼓风机位于封闭的壳体的顶部区域中,并构造成产生向下进入中央区域的空气流。称重传感器区域中的架子在封闭的壳体的中央区域和底部区域之间限定了间隔。架子与测力传感器区域的壁至少部分地间隔开,从而在架子后面限定了狭槽。穿孔的片材构造成从架子水平地延伸,并且进一步限定中心区域和底部区域之间的间隔。在该示例中,限制了由鼓风机产生的气流自由地流经穿孔的片材,并且部分地导致其重新导向测力传感器的架子,通过狭槽并进入外壳的底部区域。具有一个或多个晶片的盒子被配置为位于称重传感器中的架子上,并因此经受重定向的气流。因此,这种重新定向的空气流将在晶片的表面上缓慢流动,并在晶片暂时置于大气传输模块中的同时,帮助从晶片表面上方去除后处理气体和颗粒。

著录项

  • 公开/公告号JP4632612B2

    专利类型

  • 公开/公告日2011-02-23

    原文格式PDF

  • 申请/专利权人

    申请/专利号JP20010527326

  • 发明设计人

    申请日2000-09-28

  • 分类号H01L21/677;B65G49/07;H01L21/02;

  • 国家 JP

  • 入库时间 2022-08-21 18:20:18

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