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METHOD OF WELDING ULTRA THIN SHEET BY SEMICONDUCTOR LASER AND ULTRA HIGH-SPEED LASER MICRO WELDING APPARATUS BY THE SEMICONDUCTOR LASER

机译：半导体激光焊接超薄板的方法和半导体激光超高速激光微焊接装置

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摘要

PPROBLEM TO BE SOLVED: To provide an ultra thin sheet welding method by semiconductor laser in which a synthetic beam is formed by space coupling of combining a plurality of basic beams and by forming an irradiation beam adaptable to a joining shape of the surface to be welded of an ultra thin metallic sheet, and also to provide an ultra high-speed laser micro welding apparatus related to the method. PSOLUTION: The elliptical beams L1, L2, L3 having an identical wavelength, a beam width 0.05-0.3 mm and a beam length 0.3-1.5 mm oscillated from at least three sets of ultra small semiconductor lasers LD1, LD2, LD3 are combined by space coupling SC to form synthetic beams LO1, LO2, LO3, with ultra high-speed welding performed on an ultra thin metallic sheet of 100-10 m. PCOPYRIGHT: (C)2011,JPO&INPIT

机译：

要解决的问题：提供一种通过半导体激光器的超薄板焊接方法，其中通过组合多个基本束的空间耦合并通过形成适合于表面的接合形状的照射束来形成合成束。本发明提供一种用于焊接超薄金属板的方法，还提供一种与该方法有关的超高速激光微焊接装置。

解决方案：从至少三组超小型半导体激光器LD1，LD2，LD3产生的具有相同波长，光束宽度0.05-0.3 mm和光束长度0.3-1.5 mm的椭圆光束L1，L2，L3为通过空间耦合SC组合在一起，形成合成光束LO1，LO2，LO3，并在100-10 m的超薄金属板上进行超高速焊接。

版权：（C）2011，日本特许厅＆INPIT 展开▼

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公开/公告号JP2011020174A

专利类型
公开/公告日2011-02-03

原文格式PDF
申请/专利权人 MA TECH KK;OSAKA UNIV;
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申请/专利号JP20090182854
发明设计人 ABE NOBUYUKI;MURAKAMI KUNIO;AKAZAWA MASAMICHI;
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申请日2009-07-14
分类号B23K26/32;B23K26/06;
国家 JP
入库时间 2022-08-21 18:23:05

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