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SILICONE COMPOSITION FOR HIGH THERMAL CONDUCTIVITY POTTING MATERIAL AND METHOD FOR SELECTING HIGH THERMAL CONDUCTIVITY POTTING MATERIAL
SILICONE COMPOSITION FOR HIGH THERMAL CONDUCTIVITY POTTING MATERIAL AND METHOD FOR SELECTING HIGH THERMAL CONDUCTIVITY POTTING MATERIAL
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机译：导热性高的导电材料用硅酮组合物及选择导热性高的导电材料的方法
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摘要
PROBLEM TO BE SOLVED: To provide a silicone composition for a high thermal conductivity potting material which even with a highly filled thermally conductive filler, ensures good handleability and moldability and gives a cured product having good physical properties such as hardness, elongation, tensile strength and adhesion strength.;SOLUTION: The silicone composition for a high thermal conductivity potting material contains (A) an organopolysiloxane containing a silicon atom-bonded alkenyl group in each molecule, (B) a thermally conductive filler having an average particle diameter of 1-100 μm, and (C) a curing agent containing a silicon atom-bonded hydrogen atom in each molecule, and has such a fluidity as to give a flow of ≥50 mm in the following flow test method: 0.6 ml of the composition is taken and dropped on an Al plate; immediately after the dropping, the Al plate is tilted at a tilt angle of 28°, put in a thermostat at 40°C, taken out after the lapse of 1 h at 40°C, and put in a drier at 120°C; after curing for 10 min, the cured sample is taken out; and the length of the flowed composition is measured from end to end.;COPYRIGHT: (C)2011,JPO&INPIT
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