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PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD OF MANUFACTURING THE SAME, INSULATING PROTECTIVE COATING FILM, PHOTOSENSITIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME, RESIST PATTERN FORMING METHOD, AND PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD OF MANUFACTURING THE SAME, INSULATING PROTECTIVE COATING FILM, PHOTOSENSITIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME, RESIST PATTERN FORMING METHOD, AND PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for achieving sufficiently high sensitivity, tent reliability and adhesion when used in manufacturing a printed circuit board.;SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable unsaturated compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) cerium compound-containing solid particles. The content of the component (D) is 0.1-30 mass parts to total amount of 100 mass parts of the component (A) and component (B).;COPYRIGHT: (C)2011,JPO&INPIT
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