首页> 外国专利> TAPPING AND LASER BEAM MACHINING METHOD, WORKPIECE SUPPORTING DEVICE, AND COMPOUND MACHINE

TAPPING AND LASER BEAM MACHINING METHOD, WORKPIECE SUPPORTING DEVICE, AND COMPOUND MACHINE

机译:攻丝和激光束加工方法,工件支撑装置以及复合机

摘要

PROBLEM TO BE SOLVED: To provide a machining method capable of avoiding interference of a skid and a tap and performing tapping machining, and to provide a workpiece supporting device and a compound machine.SOLUTION: The machining method for performing machining for workpieces with the compound machine provided with a laser beam machining head and a tapping machining head at upward positions of a workpiece support table provided with skid rows of a plurality of the skids supporting plate-like workpieces at proper intervals, previously performs tapping machining of tapping machining positions where the skid row and positions are shifted rather than the tapping machining positions where the skid row and the tapping machining positions are matched, then, horizontally shifts the workpiece to a direction orthogonal to the skid row in order to shift the tapping machining positions matched with the skid row from the skid row, performs tapping machining of the tapping machining positions shifted from the skid row, and then, performs laser beam machining for separating products from the workpieces.
机译:解决的问题:提供一种能够避免打滑和攻丝的干扰并进行攻丝加工的加工方法,并提供一种工件支撑装置和复合机。解决方案:用复合物对工件进行加工的加工方法。在工件支撑台的上方位置处设有激光束加工头和攻丝加工头的机器,该工件支撑台以适当的间隔设置有多个滑板支撑板状工件的滑板行的滑板行,预先进行攻丝加工位置的攻丝加工。滑动滑行和位置,而不是移动滑行和攻丝加工位置匹配的攻丝加工位置,然后将工件水平移动到与滑行正交的方向,以便移动与滑行匹配的攻丝加工位置从打滑的行开始,执行攻丝加工位置偏移的攻丝加工然后从滑行上进行激光束加工,以将产品与工件分离。

著录项

  • 公开/公告号JP2011224728A

    专利类型

  • 公开/公告日2011-11-10

    原文格式PDF

  • 申请/专利权人 AMADA CO LTD;

    申请/专利号JP20100097122

  • 发明设计人 ONARI HIROSHI;

    申请日2010-04-20

  • 分类号B23G1/16;B23P13;B23K26/10;B23K26;B23K26/08;B23P23/04;B23Q3/18;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:53

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