首页> 外国专利> MANUFACTURING METHOD OF RESISTIVITY STANDARD SAMPLE OF EPITAXIAL WAFER AND REVISION METHOD OF RESISTIVITY MEASURING DEVICE USED THE RESISTIVITY STANDARD SAMPLE MANUFACTURED BY THE METHOD

MANUFACTURING METHOD OF RESISTIVITY STANDARD SAMPLE OF EPITAXIAL WAFER AND REVISION METHOD OF RESISTIVITY MEASURING DEVICE USED THE RESISTIVITY STANDARD SAMPLE MANUFACTURED BY THE METHOD

机译:外延晶片的电阻率标准样品的制造方法和使用该方法制造的电阻率标准样品的电阻率测量装置的修正方法

摘要

PURPOSE: A manufacturing method of a resistivity standard sample of an epitaxial wafer and a revision method of a resistivity measuring device used the resistivity standard sample manufactured by the method are provided to maintain non resistance value constant by forming a thermal oxide layer on the surface of a silicon single crystalline layer. CONSTITUTION: A wafer doped with constant resistance is manufactured(S1). An epitaxial wafer is generated by growing a single crystal silicon layer on the wafer(S2). A native oxide layer and a particle generated on a single crystal silicon layer are removed(S3). A thermal oxide layer is generated on surface of the single crystal silicon layer by using a hot furnace(S4). A surface non-resistance measurement apparatus is provided. The surface resistivity of the epitaxial wafer is measured.
机译:目的:提供外延晶片的电阻率标准样品的制造方法和使用的电阻率测量装置的修正方法,该方法制造的电阻率标准样品通过在玻璃表面上形成热氧化层来保持非电阻值恒定。硅单晶层。组成:制造了具有恒定电阻的晶圆(S1)。通过在晶片上生长单晶硅层来产生外延晶片(S2)。去除自然氧化物层和在单晶硅层上产生的颗粒(S3)。通过使用热炉在单晶硅层的表面上产生热氧化层(S4)。提供一种表面非电阻测量装置。测量外延晶片的表面电阻率。

著录项

  • 公开/公告号KR100969161B1

    专利类型

  • 公开/公告日2010-07-08

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20080071836

  • 发明设计人 김주현;방규철;

    申请日2008-07-23

  • 分类号H01L21/20;H01L21/324;H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-21 18:31:01

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