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MANUFACTURING METHOD OF THE GLASS SEALING TYPE PACKAGE MANUFACTURING THE PIEZO-ELECTRIC RESONATOR AUTHENTICALLY BONDED ANODICALLY, AND THE MANUFACTURING DEVICE AND OSCILLATOR OF THE GLASS SEALING TYPE PACKAGE
MANUFACTURING METHOD OF THE GLASS SEALING TYPE PACKAGE MANUFACTURING THE PIEZO-ELECTRIC RESONATOR AUTHENTICALLY BONDED ANODICALLY, AND THE MANUFACTURING DEVICE AND OSCILLATOR OF THE GLASS SEALING TYPE PACKAGE
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机译：玻璃封接式封装的制造方法，阳极粘结的压电谐振器，玻璃封接式封装的制造装置和振荡器
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PURPOSE: As the manufacturing method of the glass sealing type package, and the anodic bonding box the manufacturing device and oscillator of the glass sealing type package multi-form electrode. It authentically anode-bonds about the wafer making a large calibration through the entire region.;CONSTITUTION: The wafer which each other puts one upon another on the lower jig(61) of 2 each is replaced. The penetration hole(51) of the wafer for the gas exhaust hole(67) of the lower jig and lead substrate are communicated. The upper jig(63) is replaced in the upward of the wafer(40) for the Base substrate. The electrode formed in the other end of power line is connected to the glue layer.;COPYRIGHT KIPO 2011
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