首页> 外国专利> FLAME RETARDANT EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR, CAPABLE OF OBTAINING HIGH HEAT RESISTANCE AND FLAME RETARDANT PROPERTY BY INCLUDING AN ORGANIC PHOSPHOROUS-BASED FLAME RETARDANT HAVING A REACTIVE GROUP WHICH REACTS WITH AN AMINE GROUP

FLAME RETARDANT EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR, CAPABLE OF OBTAINING HIGH HEAT RESISTANCE AND FLAME RETARDANT PROPERTY BY INCLUDING AN ORGANIC PHOSPHOROUS-BASED FLAME RETARDANT HAVING A REACTIVE GROUP WHICH REACTS WITH AN AMINE GROUP

机译：阻燃半导体环氧树脂组合物，用于封装半导体，通过包含具有磷基的有机磷基阻燃物质，能够与氨基基团反应，从而获得高耐热性和阻燃特性

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PURPOSE: A flame retardant epoxy resin composition for encapsulating a semiconductor is provided to maintain basic properties of the resin at a high temperature, to prevent toxic environment in a treatment process of a flame retardant, and to obtain excellent workability.;CONSTITUTION: A flame retardant epoxy resin composition for encapsulating a semiconductor contains a flame retardant compound which is marked as a chemical formula 1. The composition is comprised of a bisphenol-based epoxy resin, an alkylated aryl diamine-based hardener, a curing accelerator, a toughener, a coupling agent, and inorganic filler. In the chemical formula 1, R is a methyl group or an ethyl group. The flame retardant compound is contained in the composition with the amount of 1-10 weight%.;COPYRIGHT KIPO 2010

机译：目的：提供一种用于封装半导体的阻燃环氧树脂组合物，以在高温下保持树脂的基本性能，防止在阻燃剂的处理过程中产生有毒环境，并获得优异的可加工性。用于封装半导体的阻燃环氧树脂组合物包含标记为化学式1的阻燃化合物。该组合物由双酚基环氧树脂，烷基化芳基二胺基硬化剂，固化促进剂，增韧剂，偶联剂和无机填料。在化学式1中，R为甲基或乙基。组合物中阻燃化合物的含量为1-10重量％。; COPYRIGHT KIPO 2010

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公开/公告号KR20100084091A

专利类型
公开/公告日2010-07-23

原文格式PDF
申请/专利权人 POONG LIM OIL CHEMICAL;
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申请/专利号KR20090003536
发明设计人 YOO GEUM SOOK;AHN TAE KWANG;KIM HAN BYEONG;HAN KI JONG;
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申请日2009-01-15
分类号C08K5/5353;C08L63/02;C08K5/49;C08K5/00;
国家 KR
入库时间 2022-08-21 18:32:13

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