Encapsulated chip scale package having flip-chip on lead frame structure

• 1. 具有感应基岛的引线框架、倒装芯片封装结构及电流检测系统 [P] . 中国专利： CN212587497U . 2021-02-23
• 2. 一种新型芯片级封装LED倒装芯片测试夹具 [P] . 中国专利： CN208420977U . 2019.01.22
• 3. ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRUCTURE AND METHOD [P] . MY148101A . 2013-02-28

  机译： 在铅框架结构上具有倒装芯片的封装芯片规模包装和方法

• 4. ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRUCTURE AND METHOD [P] . MY139752A . 2009-10-30

  机译： 在铅框架结构上具有倒装芯片的封装芯片规模包装和方法

• 5. Encapsulated chip scale package having flip-chip on lead frame structure and method [P] . 美国专利： US7439100B2 . 2008-10-21

  机译： 在引线框架上具有倒装芯片的封装芯片级封装和方法

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