Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules

• 1. 沿两侧或更多侧的具有电磁干扰(EMI)屏蔽、冷却或屏蔽冷却兼有的电源模块 [P] . 中国专利： CN109713890B . 2021.01.26
• 2. 沿两侧或更多侧的具有电磁干扰(EMI)屏蔽、冷却或屏蔽冷却兼有的电源模块 [P] . 中国专利： CN109713890A . 2019-05-03
• 3. HIGHLY EFFICIENT BOTH-SIDE-COOLED DISCRETE POWER PACKAGE, ESPECIALLY BASIC ELEMENT FOR INNOVATIVE POWER MODULES [P] . 世界知识产权组织专利： WO2007139852A8 . 2008-12-31

  机译： 高效的双面冷却离散功率封装，特别是用于创新功率模块的基本元件

• 4. HIGHLY EFFICIENT BOTH-SIDE-COOLED DISCRETE POWER PACKAGE, ESPECIALLY BASIC ELEMENT FOR INNOVATIVE POWER MODULES [P] . 美国专利： US2007273009A1 . 2007-11-29

  机译： 高效的两侧冷却离散功率封装，特别是用于创新功率模块的基本元件

• 5. HIGHLY EFFICIENT BOTH-SIDE-COOLED DISCRETE POWER PACKAGE, ESPECIALLY BASIC ELEMENT FOR INNOVATIVE POWER MODULES [P] . 世界知识产权组织专利： WO2007139852A2 . 2007-12-06

  机译： 高效的两侧冷却离散功率封装，特别是用于创新功率模块的基本元件

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• 1. Advanced Power Module Packaging and Integration Structures for High Frequency Power Conversion: From Silicon to GaN [J] . Fang LUO ,Lin LIANG ,David Huitink . 电力电子技术 . 2018,第008期
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