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You can do to the surface analysis device null surface which inspects the presence of the crack

机译:您可以对表面分析设备的空表面进行检查,以检查是否存在裂纹

摘要

PROBLEM TO BE SOLVED: To provide a surface inspection apparatus for substrates, capable of detecting processors which processor have troubles in composite semiconductor manufacturing equipment, consisting of a plurality of substrate processors made in-line.;SOLUTION: The schlieren-method surface inspection apparatus 1 is provided with a temporary placement table 2 for mounting a semiconductor substrate; a detection part 19 for detecting the presence or absence of discontinuous parts, when grayscale distribution data on images acquired be a photographing part 15 is differentiated; an image-classifying part 18 for determining whether the detected discontinuous parts are cracks or stains on the basis of their size; and a data processing part 16 for outputting photographed images on a display 20. In the photographing part 15, a light irradiated from a light source 3 is diffused in parallel by a collimator 4 and refracted by a beam splitter 7, to direct parallel beams towar the side of the back surface of the semiconductor substrate; the parallel beams are condensed onto the surface of the semiconductor substrate via a schlieren microscope 11 provided with both a varifocal lens and a silicon lens; and light reflected at the surface of the semiconductor substrate is passed through the beam splitter 7 to form an image in a camera 12.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种用于基板的表面检查设备,该设备能够检测在复合半导体制造设备中有问题的处理器的处理器,该处理器由多个在线制造的基板处理器组成;解决方案:席勒方法表面检查设备图1中,设有用于载置半导体基板的临时载置台2。检测部19,在对作为摄影部15而取得的图像的灰度分布数据进行区分时,检测不连续部的有无。图像分类部分18,用于基于其尺寸确定检测到的不连续部分是裂缝还是污点;数据处理部分16用于在显示器20上输出所拍摄的图像。在拍摄部分15中,从光源3照射的光被准直仪4平行地扩散并且被分束器7折射,以将平行光束引导至半导体衬底的背面侧;平行光束通过配备有变焦透镜和硅透镜的schlieren显微镜11会聚在半导体衬底的表面上。半导体基板的表面反射的光通过分束器7而在照相机12中成像。版权:(C)2005,JPO&NCIPI

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