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You can do to the surface analysis device null surface which inspects the presence of the crack
You can do to the surface analysis device null surface which inspects the presence of the crack
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机译:您可以对表面分析设备的空表面进行检查,以检查是否存在裂纹
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摘要
PROBLEM TO BE SOLVED: To provide a surface inspection apparatus for substrates, capable of detecting processors which processor have troubles in composite semiconductor manufacturing equipment, consisting of a plurality of substrate processors made in-line.;SOLUTION: The schlieren-method surface inspection apparatus 1 is provided with a temporary placement table 2 for mounting a semiconductor substrate; a detection part 19 for detecting the presence or absence of discontinuous parts, when grayscale distribution data on images acquired be a photographing part 15 is differentiated; an image-classifying part 18 for determining whether the detected discontinuous parts are cracks or stains on the basis of their size; and a data processing part 16 for outputting photographed images on a display 20. In the photographing part 15, a light irradiated from a light source 3 is diffused in parallel by a collimator 4 and refracted by a beam splitter 7, to direct parallel beams towar the side of the back surface of the semiconductor substrate; the parallel beams are condensed onto the surface of the semiconductor substrate via a schlieren microscope 11 provided with both a varifocal lens and a silicon lens; and light reflected at the surface of the semiconductor substrate is passed through the beam splitter 7 to form an image in a camera 12.;COPYRIGHT: (C)2005,JPO&NCIPI
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