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For specific application for design manner and specific application of semiconductor integrated circuit circuit block library for semiconductor integrated circuit design

机译:用于设计方式的特定应用和用于半导体集成电路设计的半导体集成电路块库的特定应用

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit for specific application that is small and has a high performance by making use of the advantage of a laminated package, to provide a method for designing such semiconductor integrated circuit at low cost in a short period, and to provide a circuit block library for designing such semiconductor integrated circuit. SOLUTION: Using a library including information about the general circuit block composed of a general element and a general element connection block, by taking advantage of the information about electrical characteristics of the general element included in this library, a first semiconductor integrated circuit chip including a circuit for specific application wherein the general element connection block is arranged is designed after its operation simulation. This first semiconductor integrated circuit and a second semiconductor integrated circuit mounted with the general-purpose element included in the library are mutually connected and stored in a common package. As a result, the problems are solved.
机译:解决的问题:通过利用层叠封装的优点,提供一种小型且具有高性能的用于特定用途的半导体集成电路,提供一种在短时间内以低成本设计这种半导体集成电路的方法。 ,并提供用于设计这种半导体集成电路的电路块库。解决方案:使用包含有关由通用元件和通用元件连接块组成的通用电路块的信息的库,通过利用该库中包含的有关通用元件的电气特性的信息,使用第一个半导体集成电路芯片特定应用电路,其中布置了通用元件连接块,是在其操作仿真之后设计的。安装有库中包括的通用元件的该第一半导体集成电路和第二半导体集成电路相互连接并存储在公共封装中。结果,解决了问题。

著录项

  • 公开/公告号JP4410380B2

    专利类型

  • 公开/公告日2010-02-03

    原文格式PDF

  • 申请/专利号JP20000117625

  • 发明设计人 山本 浩;

    申请日2000-04-19

  • 分类号H01L25/065;H01L25/07;H01L25/18;G06F17/50;

  • 国家 JP

  • 入库时间 2022-08-21 18:57:21

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