首页> 外国专利> Surface graft formation method, conductive film formation method, metal pattern formation method, multilayer wiring board formation method, surface graft material, and conductive material

Surface graft formation method, conductive film formation method, metal pattern formation method, multilayer wiring board formation method, surface graft material, and conductive material

机译:表面接枝形成方法,导电膜形成方法,金属图案形成方法,多层布线板形成方法,表面接枝材料和导电材料

摘要

The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.
机译:本发明提供了一种形成表面接枝的方法,该方法包括将能量施加到含有在其骨架中具有聚合起始部分的聚酰亚胺的基底的表面上以在该基底的表面上产生活性点并产生一个表面的方法。从活性点开始直接键合到基材表面并具有极性基团的接枝聚合物,以及由此获得的表面接枝材料。本发明还提供了一种形成导电膜的方法,该方法包括以下步骤:将能量施加到在其骨架中包含具有聚合起始部分的聚酰亚胺的基板的表面上,以在基板的表面上产生活性点并产生。从活性点开始直接连接到基材表面并具有极性基团并导致导电材料粘附到接枝聚合物上的接枝聚合物,以及由此获得的导电材料。

著录项

  • 公开/公告号JP4544913B2

    专利类型

  • 公开/公告日2010-09-15

    原文格式PDF

  • 申请/专利权人 富士フイルム株式会社;

    申请/专利号JP20040163783

  • 发明设计人 加納 丈嘉;川村 浩一;

    申请日2004-06-01

  • 分类号C08J7/16;B32B27/34;H05K3;H05K3/06;H05K3/38;H05K3/46;

  • 国家 JP

  • 入库时间 2022-08-21 19:00:55

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