首页> 外国专利> CONTROL OF PHOTOELECTROCHEMICAL (PEC) ETCHING BY MODIFICATION OF LOCAL ELECTROCHEMICAL POTENTIAL OF SEMICONDUCTOR STRUCTURE RELATIVE TO ELECTROLYTE

CONTROL OF PHOTOELECTROCHEMICAL (PEC) ETCHING BY MODIFICATION OF LOCAL ELECTROCHEMICAL POTENTIAL OF SEMICONDUCTOR STRUCTURE RELATIVE TO ELECTROLYTE

机译:通过修饰相对于电解质的半导体结构的局部电化学势来控制光化学(PEC)刻蚀

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a III-nitride semiconductor structure and including the strategic modification of the local electrochemical potential of the semiconductor structure relative to the electrolyte so that highly-selective photo-induced etching is performed.;SOLUTION: The method locally controls the electrical potential of a semiconductor structure or a device, and thereby locally controls lateral and/or vertical photoelectrochemical (PEC) etching rates by the appropriate placement of electrically resistive layers or layers that impede electron flows in the semiconductor structure, and/or by disposing a cathode in contact with a specific layer of the semiconductor structure during PEC etching.;COPYRIGHT: (C)2010,JPO&INPIT
机译:要解决的问题:提供一种制造III族氮化物半导体结构的方法,该方法包括对半导体结构相对于电解质的局部电化学势进行战略性修改,以便进行高度选择性的光致刻蚀。该方法局部地控制半导体结构或器件的电势,从而通过适当地放置电阻层或阻碍电子在半导体结构中流动的层来局部地控制横向和/或垂直光电化学(PEC)蚀刻速率,以及/或通过在PEC蚀刻过程中将阴极置于与半导体结构的特定层接触的方式。;版权所有:(C)2010,JPO&INPIT

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