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PLATE LAMINATED STRUCTURE, PLATE REINFORCED STRUCTURE, PLATE CONNECTED STRUCTURE, AND PLATE LAMINATION METHOD

机译：板叠层结构，板增强结构，板连接结构和板叠层方法

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摘要

PPROBLEM TO BE SOLVED: To provide a plate lamination method which comprises stacking plates different from each other in a material grade on top of each other and joining the plates to each other by spot welding. PSOLUTION: A second plate material 2 and a third plate material 3, which can be spot-welded to a first plate material 1, are superimposed respectively on both surfaces of the first plate material 1. The first plate material 1 is formed of a material different from a material, of which the second and third plate materials are formed, and has a positioning hole 4. A positioning protrusion 5 corresponding to the positioning hole 4 in the first plate material 1 is formed in at least one of the second plate material 2 and the third plate material 3. The positioning protrusion 5 is fitted into the positioning hole 4 in the first plate material 1, and the second plate material 2 and the third plate material 3 are spot-welded to the first plate material 1 at the positioning protrusion 5 fitted into the positioning hole 4 in the first plate material 1. PCOPYRIGHT: (C)2011,JPO&INPIT

机译：

要解决的问题：提供一种板层压方法，该方法包括将彼此不同的材料等级的彼此堆叠的板堆叠在彼此之上，并且通过点焊将板彼此接合。

解决方案：可以点焊到第一板材1的第二板材2和第三板材3分别叠加在第一板材1的两个表面上。形成第一板材1与形成第二和第三板材的材料不同的材料具有定位孔4。在第一板材1中的至少一个中形成与第一板材1中的定位孔4相对应的定位突起5。在第1板材1的定位孔4内嵌合有定位突起5，将第2板材2和第3板材3点焊在第1板材上。在安装在第一板材1的定位孔4中的定位突起5处的位置如图1所示。

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公开/公告号JP2010240678A

专利类型
公开/公告日2010-10-28

原文格式PDF
申请/专利权人 SEKI KOGYO KK;
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申请/专利号JP20090090366
发明设计人 MIURA MASAAKI;MIURA SEIJI;SAKOTA KOJI;
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申请日2009-04-02
分类号B23K11/11;B23K11/20;
国家 JP
入库时间 2022-08-21 19:05:21

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