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Integration 3d of vertical components in the substrates reconstituted.

机译:垂直成分在基板中的整合3d被重构。

摘要

A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
机译:一种重构的电子设备,包括:第一面和第二面;多个垂直于这些面放置的单独芯片,每个单独芯片在其一个表面上承载至少一个与重构的电子设备的一个或多个面齐平的部件,轨道和连接机构;以及封装各个芯片的密封剂。

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