首页>
外国专利>
Integration 3d of vertical components in the substrates reconstituted.
Integration 3d of vertical components in the substrates reconstituted.
展开▼
机译:垂直成分在基板中的整合3d被重构。
展开▼
页面导航
摘要
著录项
相似文献
摘要
A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
展开▼