首页> 外国专利> Preparing material for forming electrical contact pellet, comprises synthesizing powder, deagglomerating reinforcement particles, mixing the powder in silver nitrate solution, obtaining powder containing silver oxide particles and reducing

Preparing material for forming electrical contact pellet, comprises synthesizing powder, deagglomerating reinforcement particles, mixing the powder in silver nitrate solution, obtaining powder containing silver oxide particles and reducing

机译:用于形成电接触片的材料包括:合成粉末,使增强颗粒解聚,将粉末在硝酸银溶液中混合,获得包含氧化银颗粒的粉末以及还原性粉末。

摘要

Preparation of a material for producing electrical contact pellet, where the material comprises a silver based alloy matrix conductor containing a reinforcement made of ceramic compound (e.g. tin oxide) and a doping agent (e.g. copper oxide) to improve the electrical performances, comprises: synthesizing a powder containing reinforcement coated with doping agent; deagglomerating the reinforcement particles contained in the powder, by attrition; mixing the deagglomerated powder in a silver nitrate solution; obtaining a powder containing silver oxide particles; and reducing silver oxide. Preparation of a material for producing electrical contact pellet, where the material comprises a silver based alloy matrix conductor containing a reinforcement made of ceramic compound (tin oxide, cadmium oxide, iron (I) carbonate, zinc oxide, zirconium oxide, zirconium boride, tungsten or tungsten carbide) and a doping agent (copper oxide, tungsten trioxide, molybdenum trioxide, bismuth oxide, antimony oxide, tellurium dioxide, ruthenium oxide, magnesium oxide, germanium (IV) oxide, tantalum pentoxide, zinc oxide, iron (I) carbonate, niobium pentoxide or tantalum carbide powder) to improve the electrical performances, comprises: synthesizing a powder containing reinforcement coated with doping agent, where the reinforcement particles have a sub-micron size, diameter of the particles is less than 1 mu m; deagglomerating the reinforcement particles contained in the powder, by attrition; mixing the deagglomerated powder in a silver nitrate solution; obtaining a powder containing silver oxide particles and reinforcement particles in which the doping agent is diffused and nitrate is neutralized by a base, by a chemical engineering process; reducing silver oxide by calcining, where the temperature of calcination is greater than 500[deg] C; and obtaining a powder containing silver mixed with reinforcement particles. An independent claim is included for a pellet for contact in the material, where the material is obtained by the process and the material contains more than 90% of particles of submicronic size, particles composed of tin oxide coated with copper oxide, and the diameter of coated tin oxide particles is less than 1 mu m.
机译:制备用于生产电接触粒料的材料的方法包括:合成:含有掺有掺杂剂的增强剂的粉末;通过磨损使粉末中所含的增强颗粒解聚;将解聚的粉末在硝酸银溶液中混合;获得含有氧化银颗粒的粉末;和还原氧化银。制备用于生产电接触粒料的材料,其中该材料包括银基合金基体导体,其包含由陶瓷化合物(氧化锡,氧化镉,碳酸铁(I),氧化锌,氧化锆,硼化锆,钨)制成的增强材料或碳化钨)和掺杂剂(氧化铜,三氧化钨,三氧化钼,氧化铋,氧化锑,二氧化碲,氧化钌,氧化镁,氧化锗(IV),五氧化钽,氧化锌,碳酸铁(I) (五氧化二铌或碳化钽粉末)以改善电性能,包括:合成包含涂覆有掺杂剂的增强材料的粉末,其中增强颗粒具有亚微米尺寸,颗粒直径小于1μm;通过磨损使粉末中所含的增强颗粒解聚;将解聚的粉末在硝酸银溶液中混合;通过化学工程方法获得包含氧化银颗粒和增强颗粒的粉末,其中掺杂剂扩散并且硝酸盐被碱中和。通过煅烧来还原氧化银,其中煅烧温度大于500℃;得到含有与增强颗粒混合的银的粉末。对于与材料接触的小球包括一个独立的权利要求,其中该材料是通过该方法获得的,并且该材料包含90%以上的亚微米尺寸颗粒,由氧化铜涂层的氧化锡组成的颗粒以及涂覆的氧化锡颗粒小于1微米。

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