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A method for producing a floor covering under position and a method for producing a backing layer for a floor covering under position with at least one integrated electronic component
A method for producing a floor covering under position and a method for producing a backing layer for a floor covering under position with at least one integrated electronic component
The invention relates to a method for producing a floor covering under position, a floor covering under position, a method for the integration of at least one electronic component in a floor, a floor with at least one integrated electronic component, a method for producing an undercoat being for a floor covering under layer as well as a backing layer for a floor covering under position.In a method for making a floor covering under position, at least one electronic component in a layer which has at least a hardenable material, embedded. In a method for making a backing layer for a floor covering under position, a backing layer is provided, wherein the backing layer or a permeable structure has a mesh structure. Furthermore, at least one electronic component is introduced into the backing layer and / or on the backing layer is applied.
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