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Workpiece e.g. silicon wafer, coating method, involves determining coating thickness function, which reproduces coating thickness distribution on workpiece and calculating time and/or movement function for controlling spraying device
Workpiece e.g. silicon wafer, coating method, involves determining coating thickness function, which reproduces coating thickness distribution on workpiece and calculating time and/or movement function for controlling spraying device
The method involves providing a workpiece (1), and coating the workpiece by a spraying device (2) in sections. Coating thickness distribution is determined on the workpiece in sections. A coating thickness function, which approximately reproduces the coating thickness distribution on the workpiece is determined. A time and/or movement function for controlling the spraying device is calculated depending a preset coating thickness profile. An independent claim is also included for a device for coating a workpiece.
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