IMPROVEMENT OF THE JOINT RELIABILITY BETWEEN SN-3.5AG SOLDER AND NI-P UNDER BUMP METALLIZATION BY CO ADDITION

• 1. 一种避免焊料融化飞溅影响的焊接防护面罩 [P] . 中国专利： CN113633463A . 2021-11-12
• 2. 低成本、抗裂、可丝网印刷的金属化提高组件可靠性 [P] . 中国专利： CN113474900A . 2021-10-01
• 3. Improvement of the Joint Reliability between Sn-3.5Ag Solder and Ni-P Under Bump Metallization by Co addition [P] . 韩国专利： KR100975654B1 . 2010-08-17

  机译： 通过添加Co来改善凸块金属化条件下Sn-3.5Ag焊料与Ni-P的结合可靠性

• 4. JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION [P] . 美国专利： US2009212422A1 . 2009-08-27

  机译： 钴添加对凸块金属层下Sn-yAg焊料和Ni-P焊料连接的接头可靠性

• 5. SOLDER JOINT HAVING HIGH RELIABILITY MULTILAYER STRUCTURE AND MANUFACTURING METHOD THEREOF FOR FACILITATING FORMATION OF COPPER-TIN INTERMETALLIC COMPOUND ON SOLDER JOINT DURING REFLOW OPERATION [P] . 韩国专利： KR20050002577A . 2005-01-07

  机译： 具有高可靠性多层结构的焊点及其制造方法，以利于在回流操作过程中在焊点上形成铜-锡中间化合物

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• 2. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际, 光华, 盛光敏, 中南大学学报（英文版） . 2016,第008期
• 3. Effects of Cu Contents in Pb-Free Solder Alloys on Interfacial Reactions and Bump Reliability of Pb-Free Solder Bumps on Electroless Ni-P Under-Bump Metallurgy [J] . Young-Doo Jeon, Kyung-Wook Paik, Adreas Ostmann, Journal of Electronic Materials . 2005,第1期
• 4. Barrier properties of thin Au/Ni-P under bump metallization for Sn-3.5Ag solder [J] . Kumar A, He M, Chen Z Surface & Coatings Technology . 2005,第1a3期
• 5. Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations [J] . ADITYA KUMAR, YING YANG, CHEE C. WONG, Journal of Electronic Materials . 2009,第1期
• 6. Effect of Electric Current on the Mechanical Properties and Interfacial Microstructure of Ni-P/Sn-3.5Ag and Ni/Sn-3.5Ag Solder Joints [C] . Aditya Kumar, Zhong Chen, C. C. Wong, Electronic Packaging Technology Conference . 2006
• 7. Reliability improvement of area array solder joints: Changing attachment pad geometry. [D] . Primavera, Anthony Andrew. 2000
• 8. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014
• 9. Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization [O] . Keran Zhang -1

• 1. Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag [J] . 周萍 ,胡炳亭 ,周孑民 . 中南大学学报 . 2009,第003期
• 2. Effect of Lanthanum on Driving Force for Cu_6Sn_5 Growth and Improvement of Solder Joint Reliability [J] . 马鑫 ,钱乙余 ,YoshidaF . 稀土学报：英文版 . 2002,第2期
• 3. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际12 ,文光华1 ,盛光敏1 . 中南大学学报 . 2016,第008期
• 4. 略谈影响焊接可靠性的因素——提高焊接可靠性的点滴体会 [C] . 张玉珍 . 中国电子学会生产技术学会第四届装联学术年会 . 1991
• 5. 污泥-凹凸棒共热解生物炭对土壤重金属化学形态的影响 [A] . 杜昊霖 . 2019