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SEMICONDUCTOR TEST APPARATUS USING BURN-IN TEST SOCKET AND CLEANING METHOD AND CLEANING CHIP FOR THE BURN-IN TEST SOCKET
SEMICONDUCTOR TEST APPARATUS USING BURN-IN TEST SOCKET AND CLEANING METHOD AND CLEANING CHIP FOR THE BURN-IN TEST SOCKET
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机译：烧入式测试座的半导体测试装置及烧入式测试座的清洗方法和清洗芯片
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摘要
Semiconductor piece of the present invention in semiconductor testing apparatus for test is followed closely with the socket in the semiconductor chip being inserted into aging test socket and aging test socket by contact, discloses a kind of method, for washed aging test socket. Disclosed clean method, step is to place that there is the washed chip of a polish layer in the experimental rig of semiconductor testing apparatus, method and the washing of insertion chip inserted to enter aging test socket, and cleaning one step of contact-pin socket by the cleaning chip instead of semiconductor chip for the contact followed closely with socket. In this case, it includes a buffer layer, sandwiched and frame-layer and polish layer between secheong chips, a frame-layer, polish layer. BGA washed chip, with the aging test socket for removing a semiconductor chip, there should be the width no more than BGA semiconductor chips, SOP washed chip, with the aging test socket for removing a semiconductor chip, the SOP's of semiconductor chip, its width at least summation of the width of lead frame and left and right sides projection length of chip itself. ;Clean chip, semiconductor chips, aging test socket, aging testing substrates, SOP, BGA
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