首页> 外国专利> HEAT DISSIPATION STRUCTURE, PROCESS FOR PRODUCING THE HEAT DISSIPATION STRUCTURE, HEAT DISSIPATION DEVICE USING THE HEAT DISSIPATION STRUCTURE, DIAMOND HEAT SINK, PROCESS FOR PRODUCING THE DIAMOND HEAT SINK, HEAT DISSIPATION DEVICE USING THE DIAMOND HEAT SINK, AND HEAT DISSIPATION METHOD

HEAT DISSIPATION STRUCTURE, PROCESS FOR PRODUCING THE HEAT DISSIPATION STRUCTURE, HEAT DISSIPATION DEVICE USING THE HEAT DISSIPATION STRUCTURE, DIAMOND HEAT SINK, PROCESS FOR PRODUCING THE DIAMOND HEAT SINK, HEAT DISSIPATION DEVICE USING THE DIAMOND HEAT SINK, AND HEAT DISSIPATION METHOD

机译:散热结构,制造散热结构的过程,使用散热结构的散热装置,金刚石散热片,制造金刚石散热片的过程,散热装置以及使用金刚石散热方法的散热装置

摘要

Disclosed is a heat dissipation structure, which has high thermal conductivity, has low thermal contact resistance by virtue of excellent contact with the surface of a counter material, and can absorb a thermal stress generated between the heat dissipation structure and the counter material. The heat dissipation structure is produced by heating a substrate, in which a part or the whole of the substrate surface is formed of SiC, in vacuo to sublimate silicon and to form a layer of carbon nanotubes on the substrate surface. In particular, the layer of CNT is preferably a layer of a plurality of CNTs grown substantially perpendicularly to the substrate surface. The heat dissipation structure having CNTs on the outermost surface thereof has low thermal contact resistance with the counter material because fine front ends of CNTs come into contact with even fine concaves and convexes on the surface of the counter material without providing any space.
机译:公开了一种散热结构,其具有高导热率,由于与对置材料的表面的优异接触而具有低的热接触电阻,并且可以吸收在散热结构与对置材料之间产生的热应力。通过在真空下加热其中部分或整个衬底表面由SiC形成的衬底以升华硅并在衬底表面上形成碳纳米管层来产生散热结构。特别地,CNT层优选是基本上垂直于基底表面生长的多个CNT的层。在其最外表面上具有CNT的散热结构与配对材料的热接触电阻低,这是因为CNT的细小前端与配对材料表面上的均匀细微的凹凸接触而没有提供任何空间。

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