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apparatus for manipulating droplets, method for acting on one droplet, method for uniting two or more droplets, and method for dividing a droplet into two or more droplets
apparatus for manipulating droplets, method for acting on one droplet, method for uniting two or more droplets, and method for dividing a droplet into two or more droplets
APPLIANCE FOR HANDLING DROPS, METHOD FOR ACTING A DROP, METHOD FOR JOINING TWO OR MORE DROPS AND METHOD FOR DIVIDING A DROP, TWO OR MORE DROPS. The present invention relates to apparatus and methods for manipulating droplets on a printed circuit board (PCB) are described. The droplets are actuated on a printed circuit board substrate surface by applying electrical potentials to electrodes defined in the PCB. The use of a welding mask as an electrode insulator for droplet manipulation as well as techniques for adapting other traditional PCB layers and droplet-based microfluidic materials are also described.
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