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Device for spreading viscous thermal medium on heat dissipation device for electronic component

机译：用于在电子部件的散热装置上散布粘性热介质的装置

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摘要

A spreading device (10) includes an injector (14) and a spreading tube (16) connected with the injector. The injector contains therein a viscous thermal medium material for being spread on a surface of a cooling device for electronic components. The spreading tube defines therein at least one outlet hole (164) for release of the thermal medium material contained in the injector. The spreading device further includes means formed on the spreading tube for evenly distributing the material released through the outlet hole of the spreading tube over an entire area of the surface to be applied with the thermal medium material.

机译：撒布装置（ 10 ）包括注射器（ 14 ）和与注射器相连的撒布管（ 16 ）。喷射器在其中包含粘性热介质材料，该粘性热介质材料散布在用于电子部件的冷却装置的表面上。扩散管在其中限定至少一个出口孔（ 164 ），用于释放包含在喷射器中的热介质材料。散布装置还包括形成在散布管上的装置，用于将通过散布管的出口孔释放的材料均匀地分布在要施加热介质材料的表面的整个区域上。 展开▼

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公开/公告号US7556689B2

专利类型

公开/公告日2009-07-07

原文格式PDF

申请/专利权人 CHIH-PENG LEE;TAY-JIAN LIU;
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申请/专利号US20060307544

发明设计人 CHIH-PENG LEE;TAY-JIAN LIU;
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申请日2006-02-13

分类号B05B1/16;B23K3/06;

国家 US

入库时间 2022-08-21 19:29:57

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