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STRUCTURES AND METHODS OF FORMING SIGE AND SIGEC BURIED LAYER FOR SOI/SIGE TECHNOLOGY

机译:SOI / SIGE技术形成SIGE和SIGEC埋层的结构和方法

摘要

Semiconductor structures and methods of forming semiconductor structures, and more particularly to structures and methods of forming SiGe and/or SiGeC buried layers for SOI/SiGe devices. An integrated structure includes discontinuous, buried layers having alternating Si and SiGe or SiGeC regions. The structure further includes isolation structures at an interface between the Si and SiGe or SiGeC regions to reduce defects between the alternating regions. Devices are associated with the Si and SiGe or SiGeC regions. The invention is also directed to a design structure on which a circuit resides.
机译:半导体结构和形成半导体结构的方法,更具体地说,涉及形成用于SOI / SiGe器件的SiGe和/或SiGeC埋层的结构和方法。集成结构包括具有交替的Si和SiGe或SiGeC区域的不连续埋层。该结构还包括在Si和SiGe或SiGeC区域之间的界面处的隔离结构,以减少交替区域之间的缺陷。器件与Si和SiGe或SiGeC区域关联。本发明还针对一种电路驻留在其上的设计结构。

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