首页> 外国专利> Complementary metal oxide semiconductor integrated circuit using uniaxial compressive stress and biaxial compressive stress

Complementary metal oxide semiconductor integrated circuit using uniaxial compressive stress and biaxial compressive stress

机译:利用单轴压应力和双轴压应力的互补金属氧化物半导体集成电路

摘要

A transistor may be formed of different layers of silicon germanium, a lowest layer having a graded germanium concentration and upper layers having constant germanium concentrations such that the lowest layer is of the form Si1-xGex. The highest layer may be of the form Si1-yGey on the PMOS side. A source and drain may be formed of epitaxial silicon germanium of the form Si1-zGez on the PMOS side. In some embodiments, x is greater than y and z is greater than x in the PMOS device. Thus, a PMOS device may be formed with both uniaxial compressive stress in the channel direction and in-plane biaxial compressive stress. This combination of stress may result in higher mobility and increased device performance in some cases.
机译:晶体管可以由硅锗的不同层,具有分级锗浓度的最低层和具有恒定锗浓度的上层形成,使得最低层的形式为Si 1-x Ge x 。在PMOS侧,最高层的形式可以为Si 1-y Ge y 。源极和漏极可以在PMOS侧上由Si 1-z Ge z 形式的外延硅锗形成。在一些实施例中,在PMOS器件中,x大于y并且z大于x。因此,可以形成具有在沟道方向上的单轴压缩应力和平面内双轴压缩应力的PMOS器件。在某些情况下,这种压力组合可能会导致更高的移动性和更高的设备性能。

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