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SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, INTERCHIP INTERCONNECT TEST METHOD, AND INTERCHIP INTERCONNECT SWITCHING METHOD
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, INTERCHIP INTERCONNECT TEST METHOD, AND INTERCHIP INTERCONNECT SWITCHING METHOD
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机译：半导体器件，半导体芯片，互连互连测试方法和互连互连切换方法
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摘要
A semiconductor device is provided with a first wiring (110) between chips, for electrically connecting a first semiconductor chip with a second semiconductor chip; an auxiliary second wiring (120) between chips; a test signal generating circuit (4) for transmitting a test signal from the first semiconductor chip to the second semiconductor chip through the first wiring; a judging circuit (8), which outputs a first control signal in the case of receiving the test signal through the first wiring, and outputs a second control signal, i.e., the inversion signal of the first control signal, in the case of not receiving the test signal; and switching circuits (5, 6), which set the first wiring as a channel when the first control signal is inputted from the judging circuit, and set the second wiring when the second control signal is inputted
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