首页>
外国专利>
The plated jig, being the plated jig which plates plated manner,
The plated jig, being the plated jig which plates plated manner,
展开▼
机译:电镀夹具是对电镀方式进行电镀的电镀夹具,
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a plating tool and a plating method which enable dense and uniform films to be formed on an object to be plated with high operability when plating is applied to electronic components requiring high plating accuracy.;SOLUTION: The plating tool 100 is suitable for applying electroplating to a ring-shaped bond magnet or the like, and in which a shaft 10 provided so as to span a space between the right and left frames 13a and 13b is provided with two rotary boards 11a and 11b. Each rotary board 11a and 11b is provided with a supporting part 31, and plating is performed in a state where works as the objects to be plated are hooked thereto. Each supporting part 31 is formed of a bar-shaped supporting pin 34 almost vertically projecting from the wall face of the rotary board 11, and is composed so as to include the circumferential face of a diameter-reduced part 35 as an abutting face and taper parts 36a and 36b as tilted walls formed so as to sandwich the diameter-reduced part 35 from both the sides.;COPYRIGHT: (C)2005,JPO&NCIPI
展开▼