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The plated jig, being the plated jig which plates plated manner,

机译:电镀夹具是对电镀方式进行电镀的电镀夹具,

摘要

PROBLEM TO BE SOLVED: To provide a plating tool and a plating method which enable dense and uniform films to be formed on an object to be plated with high operability when plating is applied to electronic components requiring high plating accuracy.;SOLUTION: The plating tool 100 is suitable for applying electroplating to a ring-shaped bond magnet or the like, and in which a shaft 10 provided so as to span a space between the right and left frames 13a and 13b is provided with two rotary boards 11a and 11b. Each rotary board 11a and 11b is provided with a supporting part 31, and plating is performed in a state where works as the objects to be plated are hooked thereto. Each supporting part 31 is formed of a bar-shaped supporting pin 34 almost vertically projecting from the wall face of the rotary board 11, and is composed so as to include the circumferential face of a diameter-reduced part 35 as an abutting face and taper parts 36a and 36b as tilted walls formed so as to sandwich the diameter-reduced part 35 from both the sides.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种电镀工具和电镀方法,当将电镀应用于要求高电镀精度的电子部件时,该电镀工具和电镀方法能够在被电镀物体上形成致密且均匀的膜,并且具有很高的可操作性。 100适用于对环形粘结磁体等进行电镀,并且在其中设置成跨越左右框架13a和13b之间的空间的轴10设置有两个旋转板11a和11b。每个旋转板11a和11b设置有支撑部分31,并且在将要镀的物体钩在其上的状态下进行镀。各支承部31由从旋转基板11的壁面大致垂直地突出的棒状的支承销34形成,以其直径减小部35的周面为抵接面而形成为锥状。部分36a和36b形成为倾斜壁,以便从两侧将缩径部分35夹在中间。;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4273334B2

    专利类型

  • 公开/公告日2009-06-03

    原文格式PDF

  • 申请/专利权人 セイコーエプソン株式会社;

    申请/专利号JP20040165418

  • 发明设计人 神戸 正;三ツ井 洋二;

    申请日2004-06-03

  • 分类号C25D17/08;C25D7/04;

  • 国家 JP

  • 入库时间 2022-08-21 19:38:05

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