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Building up manner and the building up device null

机译:搭建方式和搭建装置null

摘要

PROBLEM TO BE SOLVED: To obtain good joining by preventing defective joining, deformation or the like in the vicinity of the bottom of a hole part and also preventing the retention of a oxidized film. ;SOLUTION: This method for building up the hole part 3a passing through a base metal 3 has a process where a bottom is formed by stopping up one side of the hole part with a liner member 5, a process where weld metal 4 is put on the bottom of the hole part and a process where a friction bar 1 is forcefitted into the hole part while rotating the bar whose outside diameter is smaller than the bore diameter of the hole part. A plate-like spacer 6 having a through hole 6a of an approximately same diameter as the hole part is inserted between the base metal and the liner member making the through hole coincide with the hole part.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:通过防止孔部的底部附近的不良接合,变形等来获得良好的接合,并且还防止氧化膜的滞留。 ;解决方案:这种用于建造穿过贱金属3的孔部分3a的方法具有以下步骤:通过用衬里构件5塞住孔部分的一侧来形成底部;在该步骤中,放置焊接金属4在孔部的底部进行研磨的过程中,一边使外径小于孔部的内径的摩擦杆1旋转,一边将摩擦杆1压入孔部。在母材和衬套构件之间插入具有直径与孔部大致相同直径的通孔6a的板状垫片6,使通孔与孔部重合。(COP)版权:(C)2001,JPO

著录项

  • 公开/公告号JP4253947B2

    专利类型

  • 公开/公告日2009-04-15

    原文格式PDF

  • 申请/专利权人 株式会社IHI;

    申请/专利号JP19990253648

  • 发明设计人 柏木 武;御巫 清和;徳永 幸二;

    申请日1999-09-07

  • 分类号B23K20/12;

  • 国家 JP

  • 入库时间 2022-08-21 19:38:32

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