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Electrical device, has heat-producing component pressed against partial area of heat sink by spring unit, where spring unit is provided between carrier and/or shell and heat producing component
Electrical device, has heat-producing component pressed against partial area of heat sink by spring unit, where spring unit is provided between carrier and/or shell and heat producing component
The electrical device has a heat-producing component (2) and a heat sink (1) for dissipating heat to environment. The heat-producing component is pressed against a partial area of the heat sink by a spring unit. The spring unit is provided between a carrier and/or a shell and the heat-producing component or is provided between a carrier and/or a shell and the heat sink. Connecting wires of the heat-producing component are provided as a spring element covered by the spring unit, where the carrier is a printed circuit board (3).
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