首页> 外国专利> MASK PATTERN FOR SELECTIVE AREA GROWTH OF SEMICONDUCTOR LAYER AND SELECTIVE AREA GROWTH METHOD USING THE MASK PATTERN FOR SEMICONDUCTOR LAYER

MASK PATTERN FOR SELECTIVE AREA GROWTH OF SEMICONDUCTOR LAYER AND SELECTIVE AREA GROWTH METHOD USING THE MASK PATTERN FOR SEMICONDUCTOR LAYER

机译:半导体层选择区生长的掩模图案和利用半导体层选择区的掩模生长方法

摘要

Provided is a mask pattern for selective area growth of a semiconductor layer and a selective area growth method for a semiconductor layer for independently controlling a growth rate and a strain of the semiconductor layer. The selective area growth method includes: forming a plurality of pairs of first mask patterns, the first mask patterns in each pair including a first open area therebetween, the first open area having a width that is wider than a distance causing overgrowth of the semiconductor layer, the pairs of the first mask patterns repeatedly arranged with a period P therebetween; wherein controlling a growth rate and a strain of the semiconductor layer formed on the first open area by adjusting the period P.
机译:提供用于半导体层的选择性区域生长的掩模图案和用于半导体层的选择性区域生长方法,用于独立地控制半导体层的生长速率和应变。选择性区域生长方法包括:形成多对第一掩模图案,每对中的第一掩模图案在其间包括第一开口区域,第一开口区域的宽度大于导致半导体层过度生长的距离。一对第一掩模图案之间以周期P重复布置;其中通过调节周期P来控制形成在第一开口区域上的半导体层的生长速率和应变。

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