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APPARATUS AND METHOD FOR COOLING ICS USING NANO-ROD BASED CHIP-LEVEL HEAT SINKS

机译：使用基于纳米棒的切屑热沉冷却ICS的装置和方法

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摘要

A method and apparatus for overcoming the problems of rapidly increasing complexity and cost and degrading reliability measures in connection with the cooling of a multi-chip mounted on an electronic printed circuit board. Accordingly, there are combined a) nano-structures materials for micro or nano-scale heat transfer from a substrate; b) small dimension heat sinks or heat spreaders matched to the mico-scale heat transfer to control the spread resistance; c) nano-scale cooling channel surfaces or micro-channel heat exchangers to improve heat transfer coefficients of the hot components to the cooling agent, air or liquid; and d) sharing of the active device such as a fan, pump, compressor, etc., that are responsible for moving the cooling agent in an active cooling embodiment. By providing appropriate passage for the cooling agent an effective and efficient cooling of the hot surfaces is achieved.

机译：一种用于克服与安装在电子印刷电路板上的多芯片的冷却相关的快速增加的复杂性和成本以及降低可靠性措施的问题的方法和设备。因此，存在以下组合：a）用于从基板进行微米或纳米级热传递的纳米结构材料; b）与微尺度传热匹配的小尺寸散热器或散热器，以控制扩散阻力; c）纳米级冷却通道表面或微通道热交换器，以提高热组分向冷却剂，空气或液体的传热系数; d）共享主动装置，例如风扇，泵，压缩机等，它们在主动冷却实施例中负责移动冷却剂。通过为冷却剂提供适当的通道，可以有效而有效地冷却热表面。

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公开/公告号WO2008060644A2

专利类型
公开/公告日2008-05-22

原文格式PDF
申请/专利权人 NANOCONDUCTION INC.;
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申请/专利号WO2007US64541
发明设计人 DANGELO CARLOS;
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申请日2007-03-21
分类号G06F1/20;H05K7/20;H05K5/00;F28F7/00;F28F25/10;F28D15/00;H01B9/06;H01B7/42;H02G3/03;F25D23/12;H01L23/24;
国家 WO
入库时间 2022-08-21 19:59:16

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