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Method of characterizing a substrate, method of characterizing a process operation, device manufacturing method and computer program
Method of characterizing a substrate, method of characterizing a process operation, device manufacturing method and computer program
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机译:表征基板的方法,表征工艺操作的方法,器件制造方法和计算机程序
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摘要
A system in which deformation of a substrate wafer is monitored during processing of the wafer is disclosed. In one embodiment, the distortion in the substrate wafer is measured after each exposure and processing operation by comparing the position of a plurality of reference marks to values in a database.
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