CMOS INTEGRATED PROCESS FOR FABRICATING MONOCRYSTALLINE SILICON MICROMECHANICAL ELEMENTS BY POROUS SILICON MICROMACHINING AND SENSOR CHIP COMPRISING SUCH ELEMENT

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  机译： 通过多孔硅微加工和包含这种元素的传感器芯片来制造单晶硅微机械元件的CMOS集成工艺

• 4. CMOS integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining [P] . 美国专利： US8115240B2 . 2012-02-14

  机译： 通过多孔硅微加工制造单晶硅微机械元件的CMOS集成工艺

• 5. CMOS integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining [P] . 美国专利： US2009261387A1 . 2009-10-22

  机译： 通过多孔硅微加工制造单晶硅微机械元件的CMOS集成工艺

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