首页> 外国专利> Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency

Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency

机译：具有提高的散热效率的印刷电路板，具有具有提高的散热效率的印刷电路板的电子设备，具有具有提高的散热效率的印刷电路板的CRT显示装置以及包括具有印刷的记录/再现装置的记录/再现装置或视频显示装置散热效率更高的电路板

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摘要

The invention provides an electric apparatus having a printed circuit board with an improved heat dissipation capacity, and, in particular, to provide an electric apparatus requiring plural printed circuit boards that has an improved heat dissipation efficiency and can be produced at a low cost.;A main printed circuit board 10 and a sub board 17 are composite-molded, and the sub board 17 is formed at an area close to or immediately below a heat-generating electronic component 23 or a heat dissipation plate 23a. Thus, by separating the sub board 17 off the main printed circuit board 10, a hole serving as a ventilating hole is formed in the main printed circuit board 10 at the area close to or immediately below the heat-generating electronic component 23 or the heat dissipation plate 23a.

机译：本发明提供了一种具有提高了散热能力的印刷电路板的电气设备，特别是提供了一种需要多个具有提高的散热效率并且可以低成本生产的印刷电路板的电气设备。主印刷电路板 10 和子板 17 被复合模制，并且子板 17 形成在靠近或靠近的区域。在发热电子元件 23 或散热板 23 a 的正下方。因此，通过将子板 17 从主印刷电路板 10 上分离，在主印刷电路板 10 < / B>靠近发热电子组件 23 或散热板 23 a或在其下方的区域。 展开▼

著录项

公开/公告号US7382619B2

专利类型

公开/公告日2008-06-03

原文格式PDF

申请/专利权人 YOSHITAKA MOURI;
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申请/专利号US20050127238

发明设计人 YOSHITAKA MOURI;
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申请日2005-05-12

分类号H05K7/20;

国家 US

入库时间 2022-08-21 20:10:12

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1. 印刷电路板以及具有该印刷电路板的显示装置 [P] . 中国专利： CN106879172B . 2021.03.23

2. 印刷电路板以及具有该印刷电路板的显示装置 [P] . 中国专利： CN106879172A . 2017-06-20

3. Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency [P] . 美国专利： US2005254218A1 . 2005-11-17

机译：具有提高的散热效率的印刷电路板，具有具有提高的散热效率的印刷电路板的电子设备，具有具有提高的散热效率的印刷电路板的CRT显示装置以及包括具有印刷的记录/再现装置的记录/再现装置或视频显示装置散热效率更高的电路板

4. HEAT DISSIPATION EFFECTS ENHANCED BOARD, AND HEAT DISSIPATION EFFECTS ENHANCED PRINTED BOARD ELECTRICAL EQUIPMENT, CRT DISPLAY APPARATUS AND RECORDING AND REPRODUCING APARATUS EQUIPPE WITH THE BOARD, OR VIDEO DISPLAY APPARATUS WITH BUILT-IN RECORDING AND REPRODUCING APPARATUS EQUIPPED WITH THE BOARD [P] . 日本专利： JP2005327896A . 2005-11-24

机译：增强板的散热效果，增强打印板的电气设备的散热效果，CRT显示设备并记录和再现带面板的设备，或者带内置记录和记录的设备附带的视频显示设备

5. PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD OF HEAT DISSIPATION TYPE FOR HEATING ELECTRONIC PARTS, AND HEAT DISSIPATION METHOD FOR HEATING ELECTRONIC PARTS ON THE PRINTED CIRCUIT BOARD [P] . 日本专利： JP2003298262A . 2003-10-17

机译：印刷电路板，用于电子部件的散热类型的印刷电路板以及在印刷电路板上的电子部件的散热方法

1. Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger [J] . Diancheng Qin, Kewei Liang 哈尔滨工业大学学报（英文版） . 2020,第001期

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